Technology Introduction :
The products of this sort is the lower reaches of LED industry. They are including the package, the test and experience, the designing and all the applications.
The LED package means to connect the outer wire to the poles of LED chip and form it as a LED device, and then pack them with silicone & other materials in order to protect the chip and enhance its lighting efficiency.
The processing sequence of LED packaging by the manufacturers of LED Lighting Show is Crystalline grain, Die bond, Die attached, Wire bonding, Silicone curing, Tin plating, Shear pins, Distribute bins and Testing.
The parts and components of high power LED lighting products from The Lighting Show should be proceeded two optic design before they are finished products.
The firs of stage is to make the LED IC chips into the LED light sources. It have to achieve the first optic design in order to settle on the angle of lighting, the strength of illumination, the volume of luminous flux, the range and distribution of color temperature.
This is called the Optimized Design of the Primary Optical System for LED Packages according to Trade Show Lighting.
The optimized design of the second optical system is only for high power LED lighting products.
This kind of products will get lens with the covers and their lighting angles are different, from 30˚ to 180˚. The second optical design will change the optic characters by the lens for the LED light Source. Simply speaking, the first optical design is to catch more light from the LED chips, and the second optical design is to make the LED devices illuminate as the demand of design.
The products of this sort is the lower reaches of LED industry. They are including the package, the test and experience, the designing and all the applications.
The LED package means to connect the outer wire to the poles of LED chip and form it as a LED device, and then pack them with silicone & other materials in order to protect the chip and enhance its lighting efficiency.
The processing sequence of LED packaging by the manufacturers of LED Lighting Show is Crystalline grain, Die bond, Die attached, Wire bonding, Silicone curing, Tin plating, Shear pins, Distribute bins and Testing.
The parts and components of high power LED lighting products from The Lighting Show should be proceeded two optic design before they are finished products.
The firs of stage is to make the LED IC chips into the LED light sources. It have to achieve the first optic design in order to settle on the angle of lighting, the strength of illumination, the volume of luminous flux, the range and distribution of color temperature.
This is called the Optimized Design of the Primary Optical System for LED Packages according to Trade Show Lighting.
The optimized design of the second optical system is only for high power LED lighting products.
This kind of products will get lens with the covers and their lighting angles are different, from 30˚ to 180˚. The second optical design will change the optic characters by the lens for the LED light Source. Simply speaking, the first optical design is to catch more light from the LED chips, and the second optical design is to make the LED devices illuminate as the demand of design.
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